16:00 15/03/2025

Conference highlights Vietnam's potential in semiconductor packaging

Phạm Vinh

The event emphasized the importance of collaboration to build a robust network for training, research, and technology transfer in Vietnam's semiconductor sector.

 The "Advanced Assembly, Testing, and Packaging Technology: Opportunities for Vietnam" conference is held in Ho Chi Minh City on March 13.
The "Advanced Assembly, Testing, and Packaging Technology: Opportunities for Vietnam" conference is held in Ho Chi Minh City on March 13.

A conference titled "Advanced Assembly, Testing, and Packaging Technology: Opportunities for Vietnam" was held in Ho Chi Minh City on March 13.

The event gathered experts from universities, industry leaders, and international specialists in the semiconductor field.

It emphasized the importance of collaboration to build a robust network for training, research, and technology transfer in Vietnam's semiconductor sector.

Participants discussed the development trajectory of the Outsourced Semiconductor Assembly and Testing (OSAT) industry, shared insights from international models, and proposed solutions tailored to Vietnam's unique context. Key discussions included topics such as Smart Manufacturing in OSAT Companies and Benefits for Vietnam, R&D Strategy and Process Development, and Semiconductor Research and Education Programs at International Universities and Vietnamese Student Exchange Opportunities.

Dr. Changhang Kim, Research Professor at HanYang University (South Korea), highlighted the critical need for close coordination between businesses, universities, and the Government to strengthen Vietnam's position in the semiconductor field.

He underscored the urgency for Vietnamese enterprises to enhance OSAT capabilities, invest in process development with artificial intelligence (AI), and lead the adoption of cutting-edge technologies like 3D IC and chiplet packaging.

To support this growth, universities were encouraged to develop advanced packaging curricula, conduct innovative research on new materials and packaging processes, and establish strong partnerships with businesses. Government initiatives and collaboration between academia and industry were deemed essential to addressing current challenges and unlocking future opportunities in Vietnam’s semiconductor packaging field.

During an in-depth discussion session, representatives from prominent institutions such as South Korea's Inha and HanYang Universities introduced educational cooperation programs and initiatives for training high-quality human resources in the semiconductor sector.

Industry leaders from companies like AMKOR, LAM Research, WooWon Technology, SPOT, WiV, and Aemulus shared insights and best practices on advancing domestic enterprises’ technological capabilities through research, education, and international collaboration.